SIB488DK Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 12 V (D-S) MOSFET

New Product
N-Channel 12 V (D-S) MOSFET
SiB488DK
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
12
R_DS(on) (Ω)
0.020 at V_GS = 4.5 V
0.024 at V_GS = 2.5 V
0.029 at V_GS = 1.8 V
PowerPAK SC-75-6L-Single
D
6
D
5
1.60 mm ^S
4
1
D
2
D
3
G
S
1.60 mm
I_D (A)^a
9
9
9
Q_g (Typ.)
7.5 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch, PA Switch and Battery Switch for Portable
Devices
• High Frequency dc-to-dc Converters
D
Marking Code
Part # code
AGX
XXX
Lot Traceability
and Date code
Ordering Information: SiB488DK-T1-GE3 (Lead (Pb)-free and Halogen-free)
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
12
V
V_GS
±8
T_C = 25 °C
9^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
9^a
9^{b, c}
T_A = 70 °C
7.2^{b, c}
A
Pulsed Drain Current
I_DM
35
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
9^a
2^{b, c}
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.4^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
Notes:
t≤5s
R_thJA
41
Steady State
R_thJC
7.5
51
°C/W
9.5
a. T_C = 25 °C, package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 65668
S10-1052-Rev. B, 03-May-10
www.vishay.com
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