SIA923EDJ Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual P-Channel 20 V (D-S) MOSFET

Dual P-Channel 20 V (D-S) MOSFET
SiA923EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.054 at V_GS = - 4.5 V
0.070 at V_GS = - 2.5 V
- 20
0.104 at V_GS = - 1.8 V
0.165 at V_GS = - 1.5 V
I_D (A)
- 4.5^a
- 4.5^a
- 4.5^a
- 1.5
Q_g (Typ.)
9.5 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^® SC-70
Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection: 2500 V
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
PowerPAK SC-70-6 Dual
1
S1
2
G1
D1
3
D2
D1
6
D2
G2
5
2.05 mm S₂
4
2.05 mm
APPLICATIONS
• Charger Switches and Load Switches for Portable
Devices
• DC/DC Converters
S₁
S₂
Marking Code
DKX
Part # code
XXX
Lot Traceability ^G1
G₂
and Date code
Ordering Information: SiA923EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
D₁
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
Limit
- 20
±8
- 4.5^a
- 4.5^a
- 4.5^{a, b, c}
- 4.5^{a, b, c}
- 15
- 4.5^a
- 1.6^{b, c}
7.8
5
1.9^{b, c}
1.2^{b, c}
- 55 to 150
260
D₂
P-Channel MOSFET
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
Document Number: 66803
S10-1535-Rev. A, 19-Jul-10
www.vishay.com
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