SIA923AEDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual P-Channel 20 V (D-S) MOSFET

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SiA923AEDJ
Vishay Siliconix
Dual P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
-20
R_DS(on) () MAX.
0.054 at V_GS = -4.5 V
0.070 at V_GS = -2.5 V
0.104 at V_GS = -1.8 V
0.165 at V_GS = -1.5 V
I_D (A)
-4.5 ^a
-4.5 ^a
-4.5 ^a
-1.5
PowerPAK^® SC-70-6L Dual
D₁
G_{2 6}
S_{2 5}
4
D1
D2
Q_g (TYP.)
9.5 nC
FEATURES
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^® SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection: 2500 V
• 100 % R_g Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Charger Switches and Load Switches for Portable Devices
• DC/DC Converters
S₁
S₂
1 _2.05 ^mm
Top View
1
2 S₁
3 G₁
D₂
Bottom View
Marking Code: DP
Ordering Information:
SiA923AEDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
G₁
G₂
P-Channel MOSFET
D₁
P-Channel MOSFET
D₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^d,e
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
LIMIT
-20
±8
-4.5 ^a
-4.5 ^a
-4.5 ^a,b,c
-4.5 ^a,b,c
-15
-4.5 ^a
-1.6 ^b,c
7.8
5
1.9 ^b,c
1.2 ^b,c
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^b,f
Maximum Junction-to-Case (Drain)
t5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
S13-2636-Rev. A, 30-Dec-13
1
Document Number: 62936
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000