SIA910EDJ Datasheet, PDF (1/7 Pages) Vishay Siliconix – Dual N-Channel 12-V (D-S) MOSFET

New Product
Dual N-Channel 12-V (D-S) MOSFET
SiA910EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.028 at V_GS = 4.5 V
12
0.033 at V_GS = 2.5 V
0.042 at Vgs = 1.8 V
PowerPAK SC-70-6 Dual
1
S₁
D1
D₁
6
G₂
5
2.05 mm S₂
4
2
G₁
D2
3
D2
2.05 mm
I_D (A)^a
4.5
4.5
4.5
Q_g (Typ.)
6.2 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection: 2400 V
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch for Portable Applications
• High Frequency dc-to-dc Converter
• DC/DC Converter
D₁
D₂
Marking Code
CFX
G₁
G₂
Part # code
XXX
Lot Traceability
and Date code
Ordering Information: SiA910EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
Limit
12
±8
4.5^a
4.5^a
4.5^{a, b, c}
4.5^{a, b, c}
20
4.5^a
1.6^{b, c}
7.8
5
1.9^{b, c}
1.2^{b, c}
- 55 to 150
260
S₂
N-Channel MOSFET
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes:
a. Package limited
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 65535
S09-2267-Rev. A, 02-Nov-09
www.vishay.com
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