SI7454DP-T1-E3 Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 100-V (D-S) MOSFET

N-Channel 100-V (D-S) MOSFET
Si7454DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.034 at V_GS = 10 V
100
0.040 at V_GS = 6.0 V
I_D (A)
7.8
7.2
PowerPAK^® SO-8
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information: Si7454DP-T1-E3 (Lead (Pb)-free)
Si7454DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET^® Power MOSFETs
• New Low Thermal Resistance PowerPAK^®
Package with Low 1.07 mm Profile
• PWM Optimized for Fast Switching
• 100 % R_g Tested
APPLICATIONS
• Primary Side Switch for High Density DC/DC
• Telecom/Server 48 V, Full-/Half-Bridge DC/DC
• Industrial and 42 V Automotive
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
10 s
Steady State
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
Continuous Drain Current (T_J = 150 °C)^a
Pulsed Drain Current
T_A = 25 °C
T_A = 85 °C
I_D
7.8
5.0
5.7
3.6
A
I_DM
30
Avalanche Current
L = 0.1 mH
I_AS
25
Single Avalanche Energy (Duty Cycle ≤ 1 %)
E_AS
31
mJ
Continuous Source Current (Diode Conduction)^a
I_S
4.0
1.6
A
Maximum Power Dissipation^a
T_A = 25 °C
T_A = 85 °C
P_D
4.8
2.6
1.9
1.0
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{b, c}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^a
t ≤ 10 s
Steady State
R_thJA
21
55
26
65
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
1.6
2
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71618
S09-0227-Rev. D, 09-Feb-09
www.vishay.com
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