SI7138DP Datasheet, PDF (1/7 Pages) Vishay Siliconix – Vishay Siliconix

Si7138DP
Vishay Siliconix
N-Channel 60 V (D-S) Reduced Q_gd, Fast Switching MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
60
0.0078 at V_GS = 10 V
0.009 at V_GS = 6 V
PowerPAK SO-8
I_D (A)^a
30
30
Q_g (Typ.)
55
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• Low Thermal Resistance PowerPAK^® Package
• 100 % R_g and Avalanche Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Primary Side Switch
- Very Low R_g and Q_gd, Critical for Minimizing Losses
D
G
Bottom View
Ordering Information: Si7138DP-T1-E3 (Lead (Pb)-free)
Si7138DP-T1-GE3 (Lead (Pb)-free) and Halogen-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
60
V
V_GS
± 20
T_C = 25 °C
30
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
30
19.7^{b, c}
Pulsed Drain Current
T_A = 70 °C
15.7^{b, c}
A
I_DM
80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
30^a
4.5^{b, c}
Avalanche Current
Single-Pulse Avalanche Energy
L = 0.1 mH
I_AS
43
E_AS
93
mJ
T_C = 25 °C
96
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
61.5
5.4^{b, c}
W
T_A = 70 °C
3.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
R_thJA
18
Steady State
R_thJC
1.0
23
°C/W
1.5
Notes:
a. Package limited.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73461). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
Document Number: 73530
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
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