SI5944DU Datasheet, PDF (1/10 Pages) Vishay Siliconix – Dual N-Channel 40-V (D-S) MOSFET

Dual N-Channel 40-V (D-S) MOSFET
Si5944DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
40
0.112 at V_GS = 10 V
0.171 at V_GS = 4.5 V
PowerPAK ChipFET Dual
1
S1
2
D1
8
D1
7
6
G1
D2
D2
5
3
S₂
4
G2
I_D (A)
6^a
4.9
Q_g (Typ.)
2.2 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
Marking Code
APPLICATIONS
CC XXX
• DC-DC Power Supply _D1
Lot Traceability
and Date Code
Part # Code
G₁
G₂
RoHS
COMPLIANT
D₂
Bottom View
Ordering Information: Si5944DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
40
V
V_GS
± 20
T_C = 25 °C
6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
4.87
3.28^{b, c}
Pulsed Drain Current
T_A = 70 °C
2.63^{b, c}
A
I_DM
10
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
8.33
1.68^{b, c}
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
5
E_AS
1.25
mJ
T_C = 25 °C
10
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
6.4
2.0^{b, c}
W
T_A = 70 °C
1.3^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
52
Steady State
R_thJC
15
62
°C/W
18
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 73683
S-81449-Rev. B, 23-Jun-08
www.vishay.com
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