SI5504BDC_10 Datasheet, PDF (1/12 Pages) Vishay Siliconix – N- and P-Channel 30 V (D-S) MOSFET

Si5504BDC
Vishay Siliconix
N- and P-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.065 at V_GS = 10 V
N-Channel 30
0.100 at V_GS = 4.5 V
P-Channel
0.140 at V_GS = - 10 V
- 30
0.235 at V_GS = - 4.5 V
I_D (A)
4^a
4^a
- 3.7
- 2.8
Q_g (Typ)
2 nC
2.2 nC
1206-8 ChipFET Dual
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFETs
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• DC/DC for Portable Applications
• Load Switch
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S₁
D₁
D₁
G₁
S₂
D₂
G₂
D₂
Marking Code
EF XXX
Lot Traceability
and Date Code
Part #
Code
Bottom View
Ordering Information: Si5504BDC-T1-E3 (Lead (Pb)-free)
Si5504BDC-T1-GE3 (Lead (Pb)-free and Halogen-free)
D₁
S₂
G₂
G₁
S₁
D₂
N-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
- 30
V_GS
± 20
V
T_C = 25 °C
4^a
- 3.7
Continuous Drain Current (T_J = 150 °C)
T_C = 85 °C
T_A = 25 °C
I_D
3.8
3.7^{b, c}
- 2.7
- 2.5^{b, c}
T_A = 85 °C
2.6^{b, c}
- 1.8^{b, c}
A
Pulsed Drain Current
I_DM
10
- 10
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
2.5
1.3^{b, c}
- 2.5
- 1.3^{b, c}
T_C = 25 °C
3.12
3.1
Maximum Power Dissipation
T_C = 85 °C
T_A = 25 °C
P_D
2
1.5^{b, c}
2
1.5^{b, c}
W
T_A = 85 °C
0.8^{b, c}
0.8^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Foot (Drain)
t≤5s
Steady State
R_thJA
R_thJF
70
85
70
85
33
40
33
40
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequade bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 120 °C/W.
Document Number: 74483
S10-0547-Rev. B, 08-Mar-10
www.vishay.com
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