SI5481DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 20-V (D-S) MOSFET

New Product
P-Channel 20-V (D-S) MOSFET
Si5481DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.022 at V_GS = - 4.5 V
- 20
0.029 at V_GS = - 2.5 V
0.041 at V_GS = - 1.8 V
I_D (A)
- 12^a
- 12^a
- 12^a
PowerPAK ChipFET Single
1
2
D
3
D
D
4
8
D
7
D
6
S
D
G
S
5
Q_g (Typ.)
20 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, Battery Switch, PA Switch and Charger
Switch for Portable Devices _S
Marking Code
BC XXX
G
Lot Traceability
and Date Code
Part #
Code
Bottom View
Ordering Information: Si5481DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V_GS
±8
V
T_C = 25 °C
- 12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 12^a
- 9.7^{b, c}
T_A = 70 °C
- 7.8^{b, c}
A
Pulsed Drain Current
I_DM
- 20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 14.8
- 2.6^{b, c}
T_C = 25 °C
17.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
11.4
3.1^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
Soldering Recommendations (Peak Temperature)^{d, e}
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
Symbol
R_thJA
R_thJC
Typical
30
5.5
Maximum
40
7
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 °C/W.
Document Number: 73777
S-81448-Rev. C, 23-Jun-08
www.vishay.com
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