SI5479DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 12-V (D-S) MOSFET

P-Channel 12-V (D-S) MOSFET
Si5479DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.021 at V_GS = - 4.5 V
- 12
0.028 at V_GS = - 2.5 V
0.039 at V_GS = - 1.8 V
I_D (A)^a
- 16.9
- 16
- 16
Q_g (Typ.)
21 nC
PowerPAK ChipFET Single
1
2
D
3
D
D
4
8
D
D
G
7
D
6
S
S
5
Marking Code
BB XXX
Lot Traceability
and Date Code
Part # Code
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
• ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, PA Switch, and Battery Switch for Portable
Applications
S
G
Bottom View
Ordering Information: Si5479DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 12
V
V_GS
±8
T_C = 25 °C
- 16^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 16^a
- 10.3^{b, c}
T_A = 70 °C
- 8.3^{b, c}
A
Pulsed Drain Current
I_DM
- 20
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 14.8
- 2.6^{b, c}
T_C = 25 °C
17.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
11.4
3.1^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
30
Steady State
R_thJC
5.5
40
°C/W
7
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 90 °C/W.
Document Number: 73368
S-81448-Rev. B, 23-Jun-08
www.vishay.com
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