SI5476DU_08 Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 60-V (D-S) MOSFET

New Product
N-Channel 60-V (D-S) MOSFET
Si5476DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
60
R_DS(on) (Ω)
0.034 at V_GS = 10 V
0.041 at V_GS = 4.5 V
PowerPAK ChipFET Single
I_D (A)^a
12
12
Q_g (Typ.)
10.5 nC
1
2
Marking Code
D
3
D
D
4
8
D
7
D
6
S
D
G
S
AA XXX
Lot Traceability
and Date Code
Part # Code
5
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
APPLICATIONS
• Load Switch for Portable Applications
• DC-DC Switch for Low Power Synchronous
Rectification
• Intermediate Switch Driver
for DC/DC Applications
G
RoHS
COMPLIANT
D
Bottom View
S
Ordering Information: Si5476DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
60
V
V_GS
± 20
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
7^{b, c}
Pulsed Drain Current
T_A = 70 °C
5.6^{b, c}
A
I_DM
25
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
12^a
2.6^{b, c}
Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
15
E_AS
11.2
mJ
T_C = 25 °C
31
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
20
3.1^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
34
Steady State
R_thJC
3
40
°C/W
4
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 90 °C/W.
Document Number: 73663
S-81448-Rev. B, 23-Jun-08
www.vishay.com
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