SI5443DC Datasheet, PDF (1/4 Pages) Vishay Siliconix – P-Channel 2.5-V (G-S) MOSFET

P-Channel 2.5-V (G-S) MOSFET
Si5443DC
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
r_DS(on) (Ω)
0.065 @ V_GS = --4.5 V
--20
0.074 @ V_GS = --3.6 V
0.110 @ V_GS = --2.5 V
I_D (A)
4.9
4.6
3.8
1206-8 ChipFETt
1
D
D
D
D
D
D
G
S
Bottom View
Ordering Information: Si5443DC-T1
S
Marking Code
BB XX
Lot Traceability
and Date Code
Part # Code
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs Steady State
Drain-Source Voltage
Gate-Source Voltage
V_DS
V_GS
--20
12
Continuous Drain Current (T_J = 150_C)^a
Pulsed Drain Current
Continuous Source Current^a
Maximum Power Dissipation^a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{b, c}
T_A = 25_C
T_A = 85_C
T_A = 25_C
T_A = 85_C
I_D
I_DM
I_AS
P_D
T_J, T_stg
4.9
3.6
3.5
--2.1
15
2.6
--1.1
2.5
1.3
1.3
0.7
--55 to 150
260
Unit
V
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^a
Maximum Junction-to-Foot (Drain)
t ≤ 5 sec
40
Steady State
R_thJA
80
Steady State
R_thJF
15
50
95
_C/W
20
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-
nection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71064
S-21251—Rev. C, 05-Aug-02
www.vishay.com
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