SI5442DU Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 20 V (D-S) MOSFET

N-Channel 20 V (D-S) MOSFET
Si5442DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.0100 at V_GS = 4.5 V
20
0.0115 at V_GS = 2.5 V
0.0135 at V_GS = 1.8 V
I_D (A)^a
25
25
25
Q_g (Typ.)
16.6 nC
PowerPAK ChipFET Single
FEATURES
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• 100% R_g Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
1
2
D
3
D
D
4
8
7
D
D
6
S
5
D
G
S
1.9 ^mm
Bottom View
Ordering Information:
Si5442DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
APPLICATIONS
• Load Switch, PA Switch, and for Portable Applications
• Point-of-Load
• DC/DC Converters
• Power Management
D
Marking Code
AQ XXX
Lot Traceability
and Date Code
G
Part # Code
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V
V_GS
±8
T_C = 25 °C
25^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
25^a
12.4^{b, c}
T_A = 70 °C
9.9^{b, c}
A
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
I_DM
T_C = 25 °C
T_A = 25 °C
I_S
60
25^a
2.6^{b, c}
T_C = 25 °C
31
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
20
3.1^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{d, e}
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t5s
R_thJA
34
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
3
40
°C/W
4
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 °C/W.
Document Number: 63233
For technical questions, contact: [e-mail]
www.vishay.com
S13-2149-Rev. B, 14-Oct-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000