SI5429DU Datasheet, PDF (1/9 Pages) Vishay Siliconix – P-Channel 30 V (D-S) MOSFET

P-Channel 30 V (D-S) MOSFET
Si5429DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
- 30
0.015 at V_GS = - 10 V
0.022 at V_GS = - 4.5 V
I_D (A)
- 12^a
- 12^a
Q_g (Typ.)
20 nC
PowerPAK ChipFET Single
1
2
D
3
D
D
4
8
D
7
D
6
S
D
G
S
5
FEATURES
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area, Thin 0.8 mm Profile
- Low On-Resistance
• 100 % R_g Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Power Management for Mobile Computing
- Adaptor Switch
- Load Switch
- DC/DC Converter
S
Bottom View
Ordering Information:
Si5429DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
Marking Code
BH XXX
Lot Traceability
and Date Code
Part #
Code
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 300 µs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
T_J, T_stg
Soldering Recommendations (Peak Temperature)^{d, e}
Limit
- 30
± 20
- 12^a
- 12^a
- 11.8^{b, c}
- 9.4^{b, c}
- 50
- 12^a
- 11.86^{b, c}
31
20
3.1^{b, c}
2^{b, c}
- 55 to 150
260
G
D
P-Channel MOSFET
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t5s
R_thJA
34
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
3
40
°C/W
4
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 °C/W.
Document Number: 63933
For technical support, please contact: [e-mail]
www.vishay.com
S12-0804-Rev. A, 16-Apr-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000