PR01000104708JR500 Datasheet, PDF (1/16 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

PR01/02/03
Vishay BCcomponents
Power Metal Film Leaded Resistors
DESCRIPTION
A homogeneous film of metal alloy is deposited on a high
grade ceramic body. After a helical groove has been cut in
the resistive layer, tinned connecting wires of electrolytic
copper or copper-clad iron are welded to the end-caps. The
resistors are coated with a red, non-flammable lacquer which
provides electrical, mechanical and climatic protection. This
coating is not resistant to aggressive fluxes. The
encapsulation is resistant to all cleaning solvents in
accordance with IEC 60068-2-45.
FEATURES
• High power in small packages (1 W/0207 size to
3 W/0617 size)
• Different lead materials for different applications
• Defined interruption behaviour
• Lead (Pb)-free solder contacts
• Pure tin plating provides compatibility with lead (Pb)-free
and lead containing soldering processes
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• All general purpose power applications
TECHNICAL SPECIFICATIONS
VALUE
DESCRIPTION
PR01
PR02
Cu-lead
FeCu-lead
PR03
Cu-lead
FeCu-lead
Resistance Range ⁽²⁾
0.22 Ω to 1 MΩ
0.33 Ω to 1 MΩ
1 Ω to 1 MΩ
0.68 Ω to 1 MΩ
1 Ω to 1 MΩ
Resistance Tolerance and Series
± 1 % (E24, E96 series); ± 5 % (E24 series) ⁽¹⁾
Rated Dissipation, P₇₀:
R<1Ω
0.6 W
1.2 W
-
1.6 W
-
1Ω≤R
1W
2W
1.3 W
3W
2.5 W
Thermal Resistance (R_th)
Temperature Coefficient
135 K/W
75 K/W
115 K/W
≤ ± 250 ppm/K
60 K/W
75 K/W
Maximum Permissible Voltage
(U_max. AC/DC)
350 V
500 V
750 V
Basic Specifications
IEC 60115-1
Climatic Category (IEC 60068-1)
55/155/56
Stability After:
Load (1000 h, P₇₀)
Long Term Damp Heat Test (56 Days)
ΔR max.: ± (5 % R + 0.1 Ω)
ΔR max.: ± (3 % R + 0.1 Ω)
Soldering (10 s, 260 °C)
ΔR max.: ± (1 % R + 0.05 Ω)
Notes
(1) _{1 % tolerance is available for Rn-range from 1 R upwards}
(2) _{Ohmic values (other than resistance range) are available on request}
• R value is measured with probe distance of 24 mm ± 1 mm using 4-terminal method
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Document Number: 28729
Revision: 14-Oct-09