V23990-K242-A-PM Datasheet, PDF (8/17 Pages) Vincotech – Solderless spring contact mounting system

V23990-K242-A-PM
T1,T2,T3,T4,T5,T6,T7 / D1,D2,D3,D4,D5,D6,D7
Figure 17
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI₀/dt,dI_rec/dt = f(I_C)
4000
dI₀/dt
3200
dI_rec/dt
2400
dI_o/dt_{Low T}
1600
di₀/dt_{High T}
800
D1,D2,D3,D4,D5,D6,D7 FWD
dI_rec/dt_{Low T}
Figure 18
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI₀/dt,dI_rec/dt = f(R_gon)
6000
4500
D1,D2,D3,D4,D5,D6,D7 FWD
dI₀/dt
dI_rec/dt
dI_rec/dt_{High T}
3000
1500
0
0
30
60
At
T_j =
V_CE =
V_GE =
R_gon =
25/125 °C
300
V
±15
V
8
Ω
Figure 19
IGBT transient thermal impedance
as a function of pulse width
Z_thJH = f(t_p)
10¹
90
120 I C (A) 150
0
0
8
16
24
32 R gon ( Ω ) 40
At
T_j =
V_R =
I_F =
V_GE =
25/125 °C
300
V
75
A
±15
V
T1,T2,T3,T4,T5,T6,T7 IGBT
Figure 20
FWD transient thermal impedance
as a function of pulse width
Z_thJH = f(t_p)
D1,D2,D3,D4,D5,D6,D7 FWD
10⁰
10^-1
10^-2
10^-5
10^-4
10^-3
10^-2
10^-1
At
D=
R_thJH =
t_p / T
0,75
K/W
IGBT thermal model values
Thermal grease
R (C/W) Tau (s)
0,02
9,4E+00
0,12
1,1E+00
0,41
2,1E-01
0,14
4,0E-02
0,04
6,3E-03
0,02
4,0E-04
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
10^{0 t p (s)}
10¹10
At
D=
R_thJH =
t_p / T
1,20
K/W
FWD thermal model values
Thermal grease
R (C/W) Tau (s)
0,02
9,9E+00
0,19
1,0E+00
0,54
1,8E-01
0,27
3,4E-02
0,11
6,0E-03
0,07
6,5E-04
Copyright by Vincotech
8
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
t p (s)
10
Revision: 3.1