70-W212NMA600SC03-M200P03 Datasheet, PDF (5/29 Pages) Vincotech – Mixed voltage NPC

70-W212NMA600SC03-M200P03
datasheet
Parameter
Characteristic Values
Symbol
Conditions
VGE [V] or
VGS [V]
Vr [V] or IC [A] or
VCE [V] or IF [A] or
VDS [V]
ID [A]
Tj
Value
Unit
Min
Typ
Max
half bridge FWD ( D1 , D4 )
FWD forward voltage
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
Thermal resistance chip to heatsink per chip
Thermal resistance chip to case per chip
DC link Capacitor
Capacitance
Tolerance
Dissipation factor
Climatic category
VF
Ir
IRRM
trr
Qrr Rgon=1 Ω
di(rec)max
/dt
Erec
±15
Rth(j-s)
Rth(j-c)
Phase-Change
Material
ʎ=3,4W/mK
600
1200
350
600
C
Tj=25°C
1
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
2,23
3
2,31
V
720
µA
422
568
76
290
20
61
14692
12189
4
14
A
ns
µC
A/µs
mWs
0,15
0,10
K/W
TJ=20ºC
1360
µF
-10
+10
nH
0,0004 mΩ
40/105/56
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
B-value
Vincotech NTC Reference
R
ΔR/R R100=1486 Ω
P
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
Tj=25°C
Tc=100°C -12
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
22000
200
2
3950
3996
+14
B
Ω
%
mW
mW/K
K
K
Module Properties
Module inductance (from chips to PCB)
LsCE
Module inductance (from PCB to PCB using Intercon board)
Resistance of Intercon boards (from PCB to PCB using Intercon board)
Mounting torque
Mounting torque
Terminal connection torque
Weight
LsCE
Rcc'1+EE' ^{Tc=25°C, per switch}
M
Screw M4 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M5 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M6 - mounting according to valid application note
FSWB1-4TY-M-*-HI
G
5
nH
3
nH
1,5
mΩ
2
2,2
Nm
4
6
Nm
2,5
5
Nm
710
g
copyright Vincotech
5
03 Jun. 2015 / Revision 4