70-W212NMA600NB04-M200P60 Datasheet, PDF (5/31 Pages) Vincotech – Mixed voltage NPC

70-W212NMA600NB04-M200P60
datasheet
Parameter
Characteristic Values
Symbol
Conditions
VGE [V] or
VGS [V]
Vr [V] or IC [A] or
VCE [V] or IF [A] or
VDS [V]
ID [A]
Tj
Value
Unit
Min
Typ
Max
half bridge FWD (D1, D4) ( D1 , D4 )
FWD forward voltage
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
Thermal resistance chip to heatsink per chip
Thermal resistance chip to case per chip
VF
Ir
IRRM
trr
Qrr Rgon=1 Ω
di(rec)max
/dt
Erec
±15
RthJH
100um
preapplied PCM
RthJH
100um grease
1W/mK
400
1200
350
600
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
2,19
2,47
V
48
µA
448
568
70
138
19
53
20142
14965
4
13
A
ns
µC
A/µs
mWs
0,16
K/W
0,18
K/W
DC link Capacitor
Capacitance
C
Tolerance
Dissipation factor
Climatic category
TJ=20ºC
1360
nF
-10
+10
%
0,0004
40/105/56
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
B-value
Vincotech NTC Reference
R
∆R/R R100=1486 Ω
P
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
Tj=25°C
Tj=100°C -12
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
22000
200
2
3950
3996
+14
B
Ω
%
mW
mW/K
K
K
Module Properties
Module inductance (from chips to PCB)
LsCE C-PCB
Module inductance (from PCB to PCB using Intercon board)
LsCE PCB-PCB
Resistance of Intercon boards (from PCB to PCB using Intercon board) Rcc'1+EE' ^{Tc=25°C, per switch}
Mounting torque
Mounting torque
Terminal connection torque
M
Screw M4 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M5 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M6 - mounting according to valid application note
FSWB1-4TY-M-*-HI
Weight
G
5
nH
3
nH
1,5
mΩ
2
2,2
Nm
4
6
Nm
2,5
5
Nm
710
g
copyright Vincotech
5
17 Mar. 2015 / Revision 1