70-W212NMA600NB02-M200P62 Datasheet, PDF (5/31 Pages) Vincotech – Mixed voltage NPC

70-W212NMA600NB02-M200P62
Parameter
half bridge FWD (D1, D4) ( D1 , D4 )
FWD forward voltage
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
Thermal resistance chip to heatsink per chip
Thermal resistance chip to case per chip
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
B-value
Vincotech NTC Reference
Module Properties
Module inductance (from chips to PCB)
Module inductance (from PCB to PCB using Intercon board)
Resistance of Intercon boards (from PCB to PCB using Intercon board)
Mounting torque
Mounting torque
Terminal connection torque
Weight
Characteristic Values
Symbol
Conditions
VGE [V] or
VGS [V]
Vr [V] or
VCE [V] or
VDS [V]
IC [A] or
IF [A] or
ID [A]
Tj
Value
Min
Typ
Max
Unit
VF
Ir
IRRM
trr
Qrr Rgon=1 Ω
±15
di(rec)max
/dt
Erec
RthJH
100um preapplied
PCM
RthJH
100um grease
1W/mK
400
1200
350
600
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
2,19
2,47
V
48
µA
448
568
70
138
19
53
20142
14965
4
13
A
ns
µC
A/µs
mWs
0,16
K/W
0,18
K/W
R
∆R/R R100=1486 Ω
P
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
Tj=25°C
Tj=100°C
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
22000
Ω
-12
+14
%
200
mW
2
mW/K
3950
K
3996
K
B
LsCE C-PCB
LsCE PCB-PCB
Rcc'1+EE' ^{Tc=25°C, per switch}
M
Screw M4 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M5 - mounting according to valid application note
FSWB1-4TY-M-*-HI
M
Screw M6 - mounting according to valid application note
FSWB1-4TY-M-*-HI
G
5
nH
3
nH
1,5
mΩ
2
2,2
Nm
4
6
Nm
2,5
5
Nm
710
g
copyright by Vincotech
5
Revision: 1.2