10-FZ062TA030FB-P983D18 Datasheet, PDF (4/20 Pages) Vincotech – Vincotech clip-in housing

Parameter
C.T. Inverse diode
Diode forward voltage
Thermal resistance chip to heatsink per chip
PFC Diode
Forward voltage
Reverse recovery time
Peak recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovered energy
Peak rate of fall of recovery current
Thermal resistance chip to heatsink per chip
PFC Shunt
R1 value
Temperature coeficient
Internal heat resistance
Inductance
DC link Capacitor
C value
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Power dissipation
constant
B-value
B-value
Symbol
10-FZ062TA030(FB/FB01/FB02/FB03)-P983(D18/D28/D38/D48)
10-F0062TA030(FB/FB03)-P983(D19/D49)
preliminary datasheet
Characteristic Values
Conditions
V_GE [V] or
V_GS [V]
V_r [V] or
V_CE [V] or
V_DS [V]
I_C [A] or
I_F [A] or
I_D [A]
T_j
Value
Min
Typ
Max
Unit
V_F
R_thJH
Thermal grease
thickness≤50um
λ = 1 W/mK
Tj=25°C
Tj=125°C
1,66
1,61
V
5,12
K/W
V_F
I_rm Rgoff=2Ω
15
I_RRM
t_rr
Q_rr Rgoff=2Ω
15
E_rec
di(rec)max
/dt
R_thJH
Thermal grease
thickness≤50um
λ = 1 W/mK
15
400
18
400
18
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
Tj=25°C
Tj=125°C
2,03
2,7
1,5
12
19,4
40,539
61,079
12
19,4
0,2368
0,6337
0,0526
0,1334
13672
12699
2,29
V
µA
A
ns
µC
mWs
A/µs
K/W
R
t_c 20°C to 60°C
R_thi
L
9,4
10
10,6
mΩ
< 50
ppm/K
< 6.5
K/W
<3
nH
C
480
540
600
nF
R
ǑR/R R25=22 KΩ
P
B_(25/50) Tol. ±3%
B_(25/100) Tol. ±3%
Tj=25°C
Tj=100°C
Tj=25°C
Tj=25°C
Tj=25°C
Tj=25°C
22
kΩ
-5
5
%
210
mW
3,5
mW/K
3940
K
4000
K
Copyright by Vincotech
4
Revision: 3