B048K120T15 Datasheet, PDF (8/16 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Mechanical Drawings
PRELIMINARY
SOLDER BALL
#A1 INDICATOR
21,5
0.85
1,00
18,00
1,00
0.039
0.709
0.039
6,0
0.24
(106) X ø ^0,51 SOLDER BALL
0.020
9,00
0.354
SOLDER BALL #A1
1,00 _TYP
0.039
30,00
1.181
32,0
28,8
1.26
1.13
CL
16,0
0.63
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
CL
1,00
0.06
BOTTOM VIEW
0.039
4,0
0.16
15,7
0.62
SEATING PLANE
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON BOTH TOP AND BOTTOM SURFACES
Figure 16—BCM BGA mechanical outline; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(
ø
0,51
0.020
)
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
( _01.,00309)
ø
0,53
0.021
PLATED
VIA
CONNECT TO
INNER LAYERS
0,50
0.020
1,00
0.039
SOLDER PAD #A1
18,00
0.709
9,00
0.354
1,00
0.039
(2)
X
10,00
0.394
(4)
X
6,00
0.236
20,00
0.787 _17,00
0.669
15,00
0.591
13,00
0.512
PCB CUTOUT
24,00
0.945
16,00
0.630
8,00
0.315
29,26
1.152
(106) X
ø
0,51
0.020
SOLDER MASK
DEFINED PAD
8,08
0.318
16,16
0.636
(4) X R
1,6
0.06
0,37
0.015
Figure 17—BCM BGA PCB land/VIA layout information; In-board mounting
1,00
0.039
(01.,00309)
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
45 Vicor Corporation
Tel: [phone]
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
Page 8 of 16