B048K120T15 Datasheet, PDF (1/16 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

V•I Chip^TM – BCM
Bus Converter Module
• 48V to 12V V•I Chip Converter
• 150 Watt (225 Watt for 1 ms)
• High density – up to 600 W/in³
• Small footprint – 150 W/in²
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I Chip BGA package
B048K120T15¹
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 12.5 A
K = ¹/4
Rout = 32 mΩ max
©
Actual size
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
Parameter
Values
Unit
Notes
narrow input range Voltage
+In to -In
-1.0 to 60.0
Vdc
Transformation Module (VTM) operating
+In to -In
100
Vdc
For 100 ms
from a pre-regulated 48 Vdc primary bus
PC to -In
-0.3 to 7.0
Vdc
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
TM to -In
-0.3 to 7.0
Vdc
P ^{R E L I M I N A RY applications.The BCM may be used to}
power non-isolated POL converters or as
SG to -In
+Out to -Out
500
mA
-0.5 to 15.0
Vdc
an independent 12 V source. Due to the
Isolation voltage
1500
Vdc
fast response time and low noise of the
Operating junction temperature
-40 to 125
°C
BCM, the need for limited life aluminum
Output current
12.5
A
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
Peak output current
18.7
A
eliminated—resulting in savings of board
Case temperature during reflow
208
°C
area, materials and total system cost.
Storage temperature
-40 to 150
°C
Output power
150
W
The BCM achieves a power density of
600 W/in³ and may be surface mounted
Peak output power
225
W
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power BGA package ^{Thermal Resistance}
Input to Output
See note 2
Continuous
For 1 ms
Continuous
For 1 ms
is compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Symbol
RθJC
RθJB
Parameter
Junction-to-case
Junction-to-BGA
Typ
Max
Units
1.1
1.5
°C/W
2.1
2.5
°C/W
Junction-to-BGA thermal resistance.
RθJA
Junction-to-ambient ³
6.5
7.2
°C/W
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
RθJA
Junction-to-ambient ⁴
5.0
5.5
°C/W
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T15 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T15 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45 Vicor Corporation
Tel: [phone]
vicorpower.com
V•I Chip Bus Converter
B048K120T15
Rev. 1.2
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