B048F480T30 Datasheet, PDF (5/12 Pages) Vicor Corporation – BCM Bus Converter

Specifications (continued)
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance (R_θJC)
Junction-to-board thermal impedance (R_θJB)
Min
2,250
10
125
Typ
Max
3.5
3,000
cTÜVus
CE Mark
RoHS
0.53/15
1.28/ 32,5
0.87 / 22
0.265 / 6,73
130
135
9.3
1.1
2.1
V•I Chip Bus Converter Module
Unit
Mhrs
Vdc
pF
MΩ
oz /g
in / mm
in / mm
in / mm
°C
Ws /°C
°C / W
°C / W
Note
25°C, GB
Input to output
Input to output
Input to output
UL /CSA 60950-1, EN 60950-1
Low voltage directive
See Mechanical Drawings, Figures 15 – 18
Junction temperature
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
Min
Typ
Max
Unit
4.8
5.0
5.2
Vdc
2.4
2.5
Vdc
2.5
2.6
Vdc
2.4
2.5
2.9
mA
67
ms
40
µs
Note
Source only
See Figure 12, time from PC low to output low
Figure 12 — V_OUT at full load vs. PC disable
Figure 13 — PC signal during fault
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048F480T30
Rev. 2.9
Page 5 of 12