B048F480T30 Datasheet, PDF (11/12 Pages) Vicor Corporation – BCM Bus Converter

Application Note (continued)
F1
10 A
Fuse
C1
47 µF
electrolytic
Input reflected ripple
measurement point
Enable/Disable Switch
R2
2 kΩ
SW1 ^D1
+Out
+In
-Out
TM
RSV
BCM
PC
+Out
K
Ro -In
-Out
Figure 20 — BCM test circuit
V•I Chip Bus Converter Module
+
R3
5 mΩ
Load
C3
9.4 µF
–
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
V•I Chip Bus Converter Level 1 DC Behavioral Model for 48 V to 48 V, 300 W
IOUT
ROUT
+
188.0 mΩ
+
1 • Iout
V•I
1 • Vin
++
VIN
IQ
––
58 mA
K
–
VOUT
–
©
Figure 21 — This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip Bus Converter Level 2 Transient Behavioral Model for 48 V to 48 V, 300 W
L IN = 5 nH
IOUT
14.8 nH
ROUT
Lout 1.6 nH
+
188.0 mΩ
+
R_CIN
1.3 mΩ
1 • Iout
V•I
47.1 mΩ
1 • Vin
R_COUT
0.87 mΩ
CIN
4.0 µF
++
COUT
6 µF
VIN
IQ
VOUT
––
58 mA
K
–
–
©
Figure 22 — This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048F480T30
Rev. 2.9
Page 11 of 12