VS-709_12 Datasheet, PDF (6/9 Pages) Vectron International, Inc – Dual Frequency VCSO

VS-709 Dual Frequency VCSO
Reliability
VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and IR reflow
simulation. The VS-705 family is capable of meeting the following qualification tests:
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solvents
Moisture Sensitivity Level
Environmental Compliance
Conditions
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2016
IPC/JEDEC J-STD-020, MSL1
Handling Precautions
Although ESD protection circuitry has been designed into the VS-709 proper precautions should be taken when handling and
mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD susceptibility testing and design
protection evaluation.
Model
Human Body Model
Charged Device Model
Machine Model
ESD Ratings
Minimum
1500V
1000V
200 V
Conditions
MIL-STD-883, Method 3015
JEDEC, JESD22-C101
JEDEC, JESD22-A115-A
Parameter
PreHeat Time
Ramp Up
Time Above 217 °C
Time To Peak Temperature
Time at 260 °C
Ramp Down
Reflow Profile (IPC/JEDEC J-STD-020)
Symbol
t
S
R
UP
t
L
T
AMB-P
t
P
R
DN
Value
60 sec Min, 180 sec Max
3 °C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 °C/sec Max
The VS-709 has been qualified to meet the JEDEC standard
for Pb-Free assembly. The temperatures and time intervals
listed are based on the Pb-Free small body requirements.
The temperatures refer to the topside of the package,
measured on the package body surface. The VS-709 device is
hermetically sealed so an aqueous wash is not an issue.
Terminal Plating: Electroless Au > 1.50 μm over
Electroless Ni > 1.90 μm
Page6 of 9
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 06Aug2011