FX-424 Datasheet, PDF (5/8 Pages) Vectron International, Inc – Low Jitter Frequency Translator

FX-424 Low Jitter Frequency Translator
eliability
Handling Precautions
Although ESD protection circuitry has been designed into the FX-424 proper precautions should be taken when
handling and mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD
susceptibility testing and design protection evaluation
ESD Ratings
Model
Human Body Model
Charged Device Model
Minimum
500 V
500 V
Conditions
MIL-STD 883, Method 3015
JEDEC, JESD22-C101
Reflow Profile (IPC/JEDEC J-STD-020C)
Parameter
Symbol
PreHeat Time
Ramp Up
Time Above 217 ^oC
Time To Peak Temperature
Time At 260 ^oC
Ramp Down
t_S
R _UP
t_L
t _AMB-P
t_P
R _DN
The FX-424 is being qualified to meet the JEDEC
standard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-Free
small body requirements. The temperatures refer to
the topside of the package, measured on the package
body surface. The FX-424 should not be subjected to
a wash process that will immerse it in solvents. NO
.CLEAN ^{is the recommended procedure. The FX-424}
has been designed for pick and place reflow
soldering. The FX-424 may be reflowed once and
should not be reflowed in the inverted position.
Value
60 sec Min, 180 sec Max
3 ^oC/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 ^oC/sec Max
260
R
217
200
150
t_S
t _AMB-P
t_L
t_P
R _DN
25
Time (sec)
Vectron International, 267 Lowell Road, Hudson, NH 03051
Page 5 of 8
Tel: 1-88-VECTRON-1 • Web: www.vectron.com
Rev: 12Dec05