TFS161A Datasheet, PDF (4/5 Pages) Vectron International, Inc – Specification

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TELE FILTER tft GmbH / Potsdamer Straße 18 / D 14 513 TELTOW
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t_{_}fs_{_}1_{_}6_{_}1_{_}a_{_}.d_{_}o_{_}c_{________________________________________________________________________________________}0_{_}4_{_}/9_{_}7_{______}
T_{__}E_{__}L_{_}E_{___}F_{__}IL_{__}T_{_}E_{__}R_{___}t_{_}f_{_}t_{__}G_{__}m_{__}b_{__}H_{_____________________}s_{__}p_{_}e_{__}c_{_}i_{_}f_{_}ic_{__}a_{_}t_{_}i_{_}o_{_}n_{_____________________}T_{__}F_{_}S_{___}1_{__}6_{_}1_{__}A_{___}-_{_}4_{__}/4_{____}
Air reflow temperature conditions
1st and 2nd air reflow profile
Name:
Temperature:
Time:
pre-heating periods
150 °C - 170 °C
60 sec. - 90 sec.
main-heating periods
over 200 °C
20 sec. - 25 sec.
peak temperature
255 °C ± 5 °C
Chip-mount air reflow profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
20 40 60 80 100 120 140 160 180 200 220 240
time / sec.
Table for temperature vs. time during the air reflow process
time / sec.
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Tolerance of temperatures: ± 5 °C
temperature / °C
23
34
46
60
80
103
121
134
143
150
154
156
158
159
time / sec.
140
150
160
170
180
190
195
200
205
210
215
220
230
240
temperature / °C
160
161
164
170
180
205
230
255
230
205
180
165
140
120