FX-427_08 Datasheet, PDF (4/8 Pages) Vectron International, Inc – Low Jitter Frequency Translator

Reflow Profile
Parameter
PreHeat Time
Ramp Up
Time Above 217 0C
Time To Peak Temperature
Time At 260 0C
Ramp Down
Table 5. Reflow Profile (IPC/JEDEC J-STD-020C)
Symbol
t
S
R
UP
t
L
t
AMB-P
t
P
R
DN
The FX-427 is qualified to meet the JEDEC
standard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-Free
small body requirements. The temperatures refer
to the topside of the package, measured on the
package body surface. The FX-427 should not
be subjected to a wash process that will immerse
it in solvents. NO CLEAN is the recommended
procedure. The FX-427 has been designed for pick
and place reflow soldering. The FX-427 may be
reflowed once and should not be reflowed in the
inverted position.
Value
60 sec Min, 180 sec Max
3 0C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 0C/sec Max
Figure 4. Suggested IR Profile
Table 6. Tape and Reel Information
Tape Dimensions (mm)
W
F
Do
Po
P1
32
14.2
1.5
4
20
Tape and Reel
Reel Dimensions (mm)
A
B
C
D
N
W1
W2
330
1.5
13
20.2
100
44.4
50.4
#/Reel
200
Figure 5. Tape and Reel
Page 4 of 8
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