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C4550_06 Datasheet, PDF (4/5 Pages) Vectron International, Inc – Surface Mount Package Optional
Recommended Reflow Profile
C4550
OCXO
Profile Feature
Pb-Free Assembly
/Sn-Pb Assembly
Profile Feature
Average ramp-up rate (TL to Tp)
Preheat -Temperature Min Tsmin)
-Temperature Min Tsmax)
-Time (min to max) (ts)
Tsmax to TL - Ramp-up Rate
Time maintainted above - Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
3°C/second max.
150°c
200°c
60-180 seconds
3°C/second max.
217°C
60-150 seconds
max 260°C
Time 25°C to Peak Temperature
Time maintainted above
- Temperature (TL)
- Time (tL)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Note: All temperatures refer to topside of the package, measured on the package body surface.
Pb-Free Assembly
/Sn-Pb Assembly
8 minutes max.
217°C
60-150 seconds
20-40 seconds
6°C/second max.
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v.2006-11-10 · page 4 of 5
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