FX-700_09 Datasheet, PDF (3/7 Pages) Vectron International, Inc – Low Jitter Frequency Translator

Reliability
The FX-700 is capable of meeting the following qualification tests
Mechanical Shock
Mechanical Vibration
Solderability
Gross and Fine Leak
Resistance to Solvents
Parameter
Table 3. Environmental Compliance
Conditions
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2016
Handling Precautions
Although ESD protection circuitry has been designed into the the FX-700, proper precautions should be taken when handling
and mounting. VI employs a human body model and a charged-device model (CDM) for ESD susceptibility testing and design
protection evaluation. ESD thresholds are dependent on the circuit parameters used to define the model. Although no industry
wide standard has been adopted for the CDM, a standard HBM of resistance=1.5Kohms and capacitance = 100pF is widely used
and therefore can be used for comparison purposes
Model
Human Body Model
Charged Device Model
Table 4. Predicted ESD Ratings
Minimum
Conditions
1500 V
MIL-STD 883, Method 3015
1000 V
JEDEC, JESD22-C101
Solder Reflow Profile
Parameter
PreHeat Time
Ramp Up
Time Above 217 0C
Time To Peak Temperature
Time At 260 0C
Ramp Down
Table 5. Reflow Profile (IPC/JEDEC J-STD-020C)
Symbol
t
S
R
UP
t
L
t
AMB-P
t
P
R
DN
The device has been qualified to meet the JEDEC
standard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-
Free small body requirements. The temperatures
refer to the topside of the package, measured on
the package body surface. The FX-700 device is
hermetically sealed so an aqueous wash is not an
issue.
Value
60 sec Min, 180 sec Max
3 0C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 0C/sec Max
Figure 3. Suggested IR Profile
Page 3 of 7
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 31Mar2009