CHM2179B Datasheet, PDF (7/9 Pages) United Monolithic Semiconductors – W-band Mixer

W-band Mixer
CHM2179b
Typical Assembly and RF Configuration
In order to use acceptable wire bonding length, compatible with automatic
pick and place and wire bonding equipment, an external matching network is
proposed on low dielectric constant substrate.
Substrate : RO.3003
εr=3
H=127 µm
Substrate : RO.3003
εr=3
H=127 µm
Example of integration using low dielectric constant substrate : Er=3,
heigh=0.127mm (dimensions are in µm)
W=500
L=985
W1=330
W2=200
L=120
W=250
L=180
W=330
L=125
W=200
L=729
W1=200
W2=330
L=150
W=330
L=200
W=330
L=200
W1=330
W2=200
L=200
W=250
L=300
W1=200
W2=330
L=200
W=330
L=225
Ref. : DSCHM2179b6013 - 13 Jan 06
7/9
Specifications subject to change without notice
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