CHA5295 Datasheet, PDF (7/8 Pages) United Monolithic Semiconductors – 24.5-26.5GHz High Power Amplifier

24.5-26.5GHz High Power Amplifier
CHA5295
Chip Assembly and Mechanical Data
To Vd1,Vd2 DC Drain supply feed To Vd3 DC Drain supply feed
To Vg1,2,3 DC Gate supply feed
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 50µm. All dimensions are in micrometers )
Ref. : DSCHA529522297 -24-Oct.-02
7/8
Specifications subject to change without notice
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