CHM1270A98F_15 Datasheet, PDF (6/8 Pages) United Monolithic Semiconductors – W-Band Dual Channel Transmitter/Receiver

CHM1270a98F
W-Band Dual Channel Transmitter/Receiver
Recommended assembly plan
+V
Vtemp line
L_in
LO
µ-strip line
L_out
RFa
µ-strip line
L_out
RFb
µ-strip line
IFa line
IFb line
This drawing shows an example of assembly. DC power supply is required only when
temperature sensor is used.
For the RF and LO pads the equivalent wire bonding inductance (diameter=25µm) has to be
made according to the following recommendation to match 50 Ohms µ-strip line:
Recommended circuit bonding table
Label
LO
RFa
RFb
Equivalent inductance
L_in = 0.15 nH
L_out = 0.15 nH
L_out = 0.15 nH
Wire length (1)
0.2 mm (2)
0.2 mm (2)
0.2 mm (2)
Comment
LO input port
RFa input/output port
RFb input port
(1) This value is the total length including the necessary loop from pad to µ-strip line.
(2) For longer wire length or higher inductance, an external compensation is
required to match 50 between LO or RF Pins and 0.15nH wire inductance
plan. (For example with a matching network on the substrate)
Note: Chip backside must be RF grounded.
Ref. : DSCHM1270a2352 - 17 Dec 12
6/8
Specifications subject to change without notice
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