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CHA3092 Datasheet, PDF (6/7 Pages) United Monolithic Semiconductors – 20-33GHz Medium Power Amplifier
CHA3092
20-33GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
To Vd1,2,3,4 DC Drain supply feed
100pF
IN
OUT
100pF
100pF
To Vgs1 DC Gate supply feed
To external control circuit ( 10kOhm )
To Vgs2,3,4 DC Gate supply feed
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.
1720 +/- 35
1370
700
450
290
1030
880 +/- 35
440
270
160
340
640
940
1340
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA30920356 21-Dec.-00
6/7
Specifications subject to change without notice
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