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| CHA3063 Datasheet, PDF (6/7 Pages) United Monolithic Semiconductors – 5.5-23GHz Driver Amplifier | |||
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CHA3063
5.5-23GHz Driver Amplifier
Chip Assembly and Mechanical Data
Note :Supply feed should be capacitively bypassed. 25µm diameter gold wire is
recommended
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers)
Ref : DSCHA30632263 -20-Sept.-02
6/7
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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