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CHA2292 Datasheet, PDF (5/6 Pages) United Monolithic Semiconductors – 17-24GHz Low Noise, Variable Gain Amplifier
17-24GHz LNA VGA
Chip Assembly and Mechanical Data
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CHA2292
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bond Pad:100 x 100 µm
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA22922108 - 18-Apr.-02
5/6
Specifications subject to change without notice
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