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CHA2192 Datasheet, PDF (5/6 Pages) United Monolithic Semiconductors – 24-26.5GHz Low Noise Amplifier
24-26.5GHz Low Noise Amplifier
Chip Assembly and Mechanical Data
CHA2192
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA21928155
5/6
Specifications subject to change without notice
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