CHR3663-QEG Datasheet, PDF (13/16 Pages) United Monolithic Semiconductors – 17-24GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD package

17–24 GHz Down Converter
Definition of the Sij reference planes
The reference planes used for Sij
measurements given above are
symmetrical from the symmetrical axis of
the package (see drawing beside). The
input and output reference planes are
located at 3.18mm offset (input wise and
output wise respectively) from this axis.
Then, the given Sij parameters incorporate
the land pattern of the evaluation
motherboard recommended at the page
15.
CHR3663-QEG
3.18
3.18
Recommanded package footprint
Refere to the application note AN0017 available at http://www.ums-gaas.com for package foot
print recommandations.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref. : DSCHR3663-QEG8317 - 12 Nov 08
13/16
Specifications subject to change without notice
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