TGV2204-FC_15 Datasheet, PDF (9/10 Pages) TriQuint Semiconductor – 19 GHz VCO with Prescaler

TGV2204-FC
Recommended Assembly Diagram
Prescaler F/8- Output
Prescaler F/8+ Output
Alumina substrate board
Thickness: 0.38 mm
ε_r = 9.9
TGV2204-FC Die
(flip-chip bonded)
DC
100
Ground
pF
RF Gnd
RFout
RF Gnd
TGV2204-FC data
represented in this
datasheet was
taken using co-
planar waveguide
100
(CPW) transition
pF
on the substrate
and ground-signal-
ground probes
Vtune Vcc
Die is flip-chip bonded / bumped to carrier
NOTE: Vcc should be bypassed sufficiently to avoid phase noise
degradation. Bypass capacitors of 1 uF and 470 uF are recommended.
Tuning port should also be free of supply noise.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
9
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November 2009 © Rev D