TGV2204-FC_15 Datasheet, PDF (8/10 Pages) TriQuint Semiconductor – 19 GHz VCO with Prescaler

Mechanical Drawing
Drawing is for chip face-up
TGV2204-FC
Units: millimeters
Thickness: 0.38
Die x,y size tolerance: +/- 0.050
Chip edge to pillar dimensions are shown to center of pillar
Pillar #4, 7, 10, 12-15 DC Ground 0.075 ϕ
Pillar #1, 3
Pillar #2
Pillar #5
RF CPW
Ground
RF Out
Prescaler Out
(F/8-)
0.075 ϕ
0.075 ϕ
0.075 ϕ
Pillar #6
Pillar #8
Pillar #9
Pillar #11
Prescaler Out
(F/8+)
Vtune
0.075 ϕ
0.075 ϕ
Vbb (Not Used)
Vcc
0.075 ϕ
0.075 ϕ
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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November 2009 © Rev D