TGS4304 Datasheet, PDF (7/10 Pages) TriQuint Semiconductor – High Power Ka-Band Absorptive SPDT Switch

1.10 [0.043]
1.00 [0.039]
Advance Product Information
September 26, 2005
Mechanical Drawing
TGS4304
34
56
0.45 [0.018]
2
0.10 [0.004]
0.00 [0.000]
7
1
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond Pad #1
Bond Pad #2
Bond Pad #3
Bond Pad #4
Bond Pad #5
Bond Pad #6
Bond Pad #7
(RF In)
(RF Out A)
(VA)
(IA)
(IB)
(VB)
(RF Out B)
0.15 x 0.10 (0.006 x 0.004)
0.10 x 0.15 (0.004 x 0.006)
0.10 x 0.10 (0.004 x 0.004)
0.15 x 0.10 (0.006 x 0.004)
0.15 x 0.10 (0.006 x 0.004)
0.10 x 0.10 (0.004 x 0.004)
0.10 x 0.15 (0.004 x 0.006)
7
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