TC1102 Datasheet, PDF (4/4 Pages) List of Unclassifed Manufacturers – Super Low Noise GaAs FETs

SMALL SIGNAL MODEL, V_DS = 2 V, I_DS = 10 mA
SCHEMATIC
Lg
Rg
Cgd
Cgs
Gm
Cds
Ri
T
Rs
Rd Ld
Rds
PARAMETERS
Lg
0.038 nH
Rg
0.970 Ohm
Cgs
0.222 pF
Ri
1.780 Ohm
Cgd
0.027 pF
Gm
53.30 mS
T
1.490 psec
Ls
TC1102
REV5_20070502
Rs
1.7200 Ohm
Ls
0.0010 nH
Cds
0.0610 pF
Rds
328.00 Ohm
Rd
1.6980 Ohm
Ld
0.0229 nH
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil (0.018
to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force: 20 to 30
gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7^th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: [phone]
Fax: [phone]
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