TCK104G Datasheet, PDF (7/12 Pages) Toshiba Semiconductor – Load Switch IC with Current Limit function

TCK104G,TCK105G
2. Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
1000
800
600
400
200
0
-40
P_D - Ta
0
40
80
120
Ambient Temperature Ta (℃)
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for
allowable power dissipation during operation.
3. Current limit and Thermal shut down function
Current limit and Thermal shutdown function are designed in these products, but these does not assure for the
suppression of uprising device operation. In use of these products, please read through and understand dissipation
idea for absolute maximum ratings from the above mention or our ‘Semiconductor Reliability Handbook’. Then use
these products under absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe
system into the design.
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2014-03-01