TLP173A Datasheet, PDF (6/10 Pages) Toshiba Semiconductor – Telecommunications Control Equipment Data Acquisition System Security Equipment Measurement Equipment

Precautions about the Soldering of
＜Types＞
the SMD Type Photocoupler
TLP173A(F)
＜Mounting Method＞
1) Using Solder Reflow
・Temperature profile example of lead (Pb) solder
(°C)
240
210
160
140
TLP173A
60～120s
less than 30s
Time
(s)
・Temperature profile example of using lead (Pb-free) solder
(°C)
260
230
190
180
60～120s
30～50s
Time
(s)
・The use of the reflow is to twice.
・In case of second reflow soldering should be performed within 2 weeks of the first reflow under
the above conditions.
2) Using Solder Flow (for lead (Pb) solder, or lead (Pd)-free solder)
・Please preheat is at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
・The use of the reflow is to once.
3) Using a Soldering Iron
・Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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2009-12-22