TLP1004A Datasheet, PDF (5/10 Pages) Toshiba Semiconductor – INFRARED LED + PHOTO IC

TLP1004A(F),TLP1005A(F)
Precaution
Please be careful of the followings.
1. Soldering should be performed after lead forming.
2. If chemicals are used for cleaning, the soldered surface only shall be cleaned with chemicals avoiding the whole
cleaning of the package.
3. The container is made of polycarbonate. polycarbonate is usually stable with acid, alcohol, and aliphatic
hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone), alkali, aromatic
hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen, or melted. Please take care
when choosing a packaging material by referencing the table below.
<Chemicals To Avoid With Polycarbonate>
Phenomenon
A
Little deterioration
but staining
B
Cracked, crazed, or
swollen
C
Melted
( ) : Used as solvent.
D Decomposed
Chemicals
・Nitric acid (low concentration), hydrogen peroxide, chlorine
・Acetic acid (70% or more)
・Gasoline
・Methyl ethyl ketone, ethyl acetate, butyl acetate
・Ethyl methacrylate, ethyl ether, MEK
・Acetone, m−amino alcohol, carbon tetrachloride
・Carbon disulfide, trichloroethylene, cresol
・Thinners, oil of turpentine
・Triethanolamine, TCP, TBP
・Concentrated sulfuric acid
・Benzene
・Styrene, acrylonitrile, vinyl acetate
・Ethylenediamine, diethylenediamine
・(Chloroform, methyl chloride, tetrachloromethane, dioxane,
1, 2−dichloroethane)
・Ammonia water
・Other alkali
4. During 100µs after turning on VCC, output voltage changes for stabilizing the inner circuit.
5. Supply the by−pass condenser up to 0.01µF between VCC and GND near device to stabilize the power supply
line.
5
2004-02-13