TLOH9204 Datasheet, PDF (5/10 Pages) Toshiba Semiconductor – ORANGE LIGHT EMISSION AF auxiliary light source for digital still cameras

TLOH9204
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into contact with
other components.
(4) Expansion of the resin generated by the heat of reflow may alter the optical characteristics of this device.
Please take into account changes in luminous intensity during the design phase.
Mounting Methods
Reflow soldering
Temperature profile example
・ Package surface temperature: 245℃(max)
・ Perform reflow soldering no more than twice.
245℃ max(*)
4℃/sec max(*)
2～4℃/ sec max(*)
150～190℃ max(*)
220℃ max(*)
60～120s max(*)
Heating part 30±10s max(*)
Time (sec)→
(*)The product is evaluated using the above reflow soldering conditions. No additional evaluation test is performed
exceeding these conditions .
Please perform reflow soldering under the above conditions. Perform reflow soldering no more than twice.
・ Please perform the first reflow soldering within 48h of opening the package, with reference to the
above temperature profile.
・ Second reflow soldering:
Second reflow soldering should be performed within 48h of the first reflow, under the above
conditions. Storage conditions before second reflow soldering: 30℃, 70% RH or lower
・ Do not mount with manual soldering.
・ Only when the correction is needed, the manual soldering is possible only once a place.
Manual soldering conditions:
Temperature: less than 300℃ (50 W for soldering iron)
Time: within 3 s
・ Do not perform flow soldering
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2007-10-26