TLCBD1060 Datasheet, PDF (5/9 Pages) Toshiba Semiconductor – LED Lamp

TLCBD1060(T18)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
240°C max
10 s max ^(*)
140~160°C max(*)
(*)
4°C/s max
4°C/s max^(*)
60~120 s max(*)
5 s max^(*)
(*)
260°C max
4°C/s max^(*)
max(*)
150~180°C 230°C
4°C/s max^(*)
60~120 smax^(*)
Time (s)
30~50s max(*)
Time (s)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature : 300°C or less
Time
: within 3 s
• Do not perform wave soldering.
Recommended soldering pattern
0.8 1.2 0.8
Unit: mm
1.0
5
2009-05-19