TB7004FL Datasheet, PDF (5/16 Pages) Toshiba Semiconductor – Synchronous Buck Converter Module for High-Current and Low-Voltage Applications

TB7004FL
Electrical Characteristics
(VCIN = 12 V, VGIN = 5 V, V_DISBL# = 12 V, Ta = 25°C, unless otherwise specified)
Characteristics
Symbol
Pin
Test Condition
Min
Typ.
Max
Unit
Power supply
Operating input voltage
Operating input voltage
Quiescent current
Operating VGIN current
Undervoltage lockout threshold
Undervoltage lockout hysteresis
PWM signal input
V_{IN (OPR)}
V_{CIN (OPR)}
I_{CIN (OFF)}
I_{GIN (OPR)}
V_UVLO
V_hys-UVLO
PWM input rising threshold
PWM input falling threshold
PWM input resistance
3-state window
V_{H (PWM)}
V_{L (PWM)}
R_PWM
V_{W (PWM)}
VIN
VCIN
VCIN
VGIN
VCIN
VCIN
⎯
⎯
V_DISBL# = 0, V_PWM = 0
f_C = 1 MHz, duty = 10%
⎯
⎯
PWM
PWM
PWM
PWM
⎯
⎯
V_PWM = 5 V
⎯
3-state shutdown hold-off time
t_hold
PWM V_PWM = V_{W (PWM)}
DISBL# signal input
DISBL# input rising threshold
DISBL# input falling threshold
DISBL# input current
REG5V output
REG5V output voltage
Line regulation
Load regulation
Thermal shutdown
Thermal shutdown threshold
Thermal shutdown hysteresis
THDN output low voltage
THDN sink current
V_{H (DISBL#)}
V_{L (DISBL#)}
I_DISBL#
DISBL#
DISBL#
DISBL#
⎯
⎯
V_DISBL# = 0
V_OUT(REG5V)
Reg ⋅ line
Reg ⋅ load
REG5V
REG5V
REG5V
I_REG5V = −10 mA
I_REG5V = −10 mA,
V_CIN = 10 to 14 V
I_REG5V = 0 to −10 mA
T_tsdn
T_{hys - tsdn}
V_{OUT (THDN)}
I_THDN
⎯
⎯
THDN
THDN
⎯
⎯
I_THDN = 2 mA
⎯
⎯
⎯
19
V
10
12
14
V
⎯
⎯
1.3
mA
⎯
⎯
60
mA
6.5
7.2
7.9
V
⎯
2.0
⎯
V
3.2
3.5
3.8
V
1.3
1.5
1.7
V
33
50
77
kΩ
V_{L (PWM)}
⎯
V_{H (PWM)} V
⎯
200
(Note 1)
⎯
ns
3.2
3.5
3.8
V
1.3
1.5
1.7
V
⎯
⎯
5.0
μA
4.75
5.0
5.25
V
⎯
⎯
20
mV
⎯
⎯
20
mV
150
⎯
⎯
°C
⎯
15
⎯
°C
⎯
⎯
0.4
V
⎯
⎯
5
mA
Note 1: Design target only. Not 100% tested in production.
Note 2:
Don’t use the TB7004FL after thermal shutdown is tripped, because the thermal shutdown circuitry operates
beyond the rated absolute maximum temperature. The thermal shutdown circuitry cannot always protect the
device from failure. The device may be permanently damaged before thermal shutdown is tripped, depending
on usage conditions. Refer to the description of thermal shutdown on page 13.
5
2007-11-13