TB7004FL Datasheet, PDF (13/16 Pages) Toshiba Semiconductor – Synchronous Buck Converter Module for High-Current and Low-Voltage Applications

TB7004FL
Thermal Shutdown
If the integrated driver IC temperature exceeds 165°C, thermal shutdown is tripped.
TSD hysteresis: 15°C (typ.)
If the integrated MOS chip is the heating source, it takes some time for the overtemperature to be detected
at the sensor due to the distance between them. The chip temperature might exceed the TSD threshold
before the thermal shutdown circuitry is tripped.
In the TSD mode, the TB7004FL turns off both the low-side and high-side MOSFETs and keeps the internal
5-V regulator active.
Normal
operation
Thermal
shutdown
135
150
T_IC (°C)
THDN
THDN is an open-drain output that indicates thermal shutdown.
An external pull-up resistor should be connected to this pin.
During normal operation, the internal switch is off, causing THDN to be High.
In thermal shutdown mode, the internal switch is on, causing THDN to be Low.
BOOT
BOOT is an input pin from which the bootstrap capacitor is charged.
The bootstrap capacitor should be connected between this pin and VSWH.
While the PWM signal is Low (i.e., the high-side MOSFET is off), the bootstrap capacitor is charged from the
internal 5-V regulator. Be sure to use a sufficiently large capacitor.
Typical capacitance: > 0.2 μF (V_IN = 12 V, V_OUT = 1.3 V, f_C = 1 MHz)
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2007-11-13