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TK40E10N1 Datasheet, PDF (3/9 Pages) Toshiba Semiconductor – Switching Voltage Regulators | |||
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TK40E10N1
6. Electrical Characteristics
6.1. Static Characteristics (Ta = 25î unless otherwise specified)
Characteristics
Symbol
Test Condition
Min Typ. Max Unit
Gate leakage current
IGSS
VGS = ±20 V, VDS = 0 V
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±0.1
µA
Drain cut-off current
IDSS
VDS = 100 V, VGS = 0 V
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10
Drain-source breakdown voltage
Drain-source breakdown voltage
(Note 4)
V(BR)DSS ID = 10 mA, VGS = 0 V
V(BR)DSX ID = 10 mA, VGS = -20 V
100
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V
65
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Gate threshold voltage
Vth
VDS = 10 V, ID = 0.5 mA
2.0
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4.0
Drain-source on-resistance
RDS(ON) VGS = 10 V, ID = 20 A
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6.8
8.2
mâ¦
Note 4: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
6.2. Dynamic Characteristics (Ta = 25î unless otherwise specified)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Gate resistance
Switching time (rise time)
Switching time (turn-on time)
Switching time (fall time)
Switching time (turn-off time)
Symbol
Test Condition
Ciss
Crss
Coss
rg
tr
ton
tf
toff
VDS = 50 V, VGS = 0 V, f = 1 MHz
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See Figure 6.2.1
Min Typ. Max Unit
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pF
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29
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520
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2.8
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â¦
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14
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ns
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35
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21
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57
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Fig. 6.2.1 Switching Time Test Circuit
6.3. Gate Charge Characteristics (Ta = 25î unless otherwise specified)
Characteristics
Total gate charge (gate-source plus
gate-drain)
Gate-source charge 1
Gate-drain charge
Gate switch charge
Symbol
Test Condition
Qg
VDD â 80 V, VGS = 10 V, ID = 40 A
Qgs1
Qgd
QSW
Min Typ. Max Unit
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49
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nC
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18
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14
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21
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3
2012-02-01
Rev.2.0
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